Technology
Plasma enhanced chemical vapor deposition (PECVD) is a thin film deposition process that we have incorporated under our PVD platform, although it is technically a chemical vapor deposition (CVD). PECVD involves the deposition of thin films from gaseous precursor molecules that undergo chemical reactions in a radio-frequency plasma environment. The precursors molecules decompose, and fragments are then deposited onto the substrate, forming a coating. Through careful mixtures of chemicals and gases, coatings with different chemical compositions can be obtained.
PECVD operates at much lower temperatures compared to conventional CVD processes, making it suitable for coating temperature-sensitive materials like plastics.
Films deposited by PECVD can exhibit properties that are not always attainable by PVD, like outstanding chemical resistance, polymer-like properties, and improved three-dimensional coverage.
It can be combined with other PVD techniques available on our INLINECOATER platform.
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