Technology

Arc evaporation

Arc evaporation, or cathodic arc evaporation, is a very common PVD process where a high-current and low voltage electric arc is used to vaporize material from a cathode, typically a disc-shaped solid made of the material to be deposited. The vaporized material then condenses onto a substrate, forming a coating. In the coating chamber, it is common to use multiple cathodes to achieve full coating coverage. Like for magnetron sputtering, reactive process gases can be added during arc evaporation to produce ceramic coatings.

Key features and benefits of arc evaporation

Arc evaporation is a high-energy PVD process that provides a high level of ionization (30-100%) of the vaporized material, leading to highly dense coatings with very good adhesion.

The process also allows for precise control over film properties such as thickness and microstructure.

Arc evaporation can be used to deposit a wide range of materials including metals, ceramics, metal alloys and carbon. By introducing reactive process gases, it is particularly useful for producing high-performance ceramic layers.

Limitations

Micrometer-sized droplets can be ejected from the cathode and become embedded in the coating as defects. Arc evaporation sources usually incorporate optimized magnetic fields to reduce this effect.

Surface Engineering with PVD

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Arc evaporation

Key features and benefits of arc evaporation

Limitations

Magnetron sputtering

Plasma enhanced chemical vapor deposition

Plasma etching

Surface Engineering with PVD

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